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What are the basic manufacturing and process requirements for PCB boards?
发布时间：2024-05-23 15:08
First, the basic manufacturing of PCB
The Chinese name of the PCB board for circuit boards, also known as circuit boards, is an important electronic component, then pcb production of the basic process flow is what, the following small make up will take you to understand.
The basic process of pcb production is mainly: the inner line → lamination → drilling → hole metallisation → outer dry film → outer line → silk screen → surface process → after process
Inner layer line: the main process is to open the material → pretreatment → pressure film → exposure → DES → punching.
Lamination: let the copper foil, semi-cured sheet and browning treatment of the inner layer of the circuit board pressed into a multilayer board.
Hole drilling: make PCB's interlayer produce through holes, can achieve connectivity between layers.
Hole Metallisation: Metallise the non-conductive parts of the hole, which can make the plating process more convenient. If you are making a multi-layer PCB and it contains buried holes or blind holes, each layer of the board must be drilled and plated before it is glued together. Without this step, there is no way to connect them to each other. After the holes have been drilled by machines according to the drilling requirements, the inside of the hole must be plated (Plated-Through-Hole technology, PTH). Plated-Through-Hole technology (PTH) is a metal treatment on the inside of the hole, which allows the internal layers of wiring to be connected to each other. Before plating is started, the inside of the hole must be cleared of debris. This is because the resin epoxy produces some chemical changes when heated, and it will cover the internal PCB layer, so it has to be removed first. Both the removal and plating actions will be done in the chemical process.
Outer Dry Film: The desired lines are exposed on the dry film by the graphic transfer technique.
Outer Layer Circuit: The purpose is to plating the copper thickness to the thickness required by the customer and to complete the circuit shape required by the customer.
Screen Printing: The protective layer of the outer layer of the line, used to ensure the insulation of the PCB, board protection, anti-solder.
Post-processing: Finish processing according to customer's requirement and test to ensure the final quality audit. Both THT and SMT parts are mounted on the PCB using machines and equipment.
THT parts are usually soldered using a method called Wave Soldering. This allows all parts to be soldered to the PCB in one pass, first by cutting the pins close to the board and bending them slightly to allow the parts to be held in place. The PCB is then moved to a wave of fluxed solvent so that the underside is in contact with the flux, which removes oxides from the metal on the underside. After heating the PCB, this time it is moved to the melted solder, and after contacting the bottom, the soldering is completed.
After contact with the bottom, the soldering is completed.
The automatic soldering of SMT parts is called Over Reflow Soldering. The paste containing flux and solder is processed once after the part is mounted on the PCB and then again after the PCB is heated. After the PCB is cooled down, the soldering is completed, and the next step is to prepare for the final test of the PCB.
Second, the circuit board factory to speak PCB processing technology requirements
1, numbering
PCB processing is completed, it should be carried out immediately after the unified number. In order to prevent the processing, cleaning process in the marking lost, the application of marker pens clearly on both sides of the board are written on a uniform number. In order to facilitate future management, this number should be retained permanently.
2, the correct placement
In order to make the surface of the component bumps and scratches as little as possible, in the process of processing, transport, and custody of the PCB process, must pay attention to the light take and put, to prevent the occurrence of bumping, and boards and boards need to be isolated from each other to avoid contact with each other, so that PCB boards damage each other.
3, PCB processing finishing process
PCB processing and completion of the test, but also need to carry out finishing work on the whole board, including, clear the surface of the excess goods such as high pins and metal residues; PCB processing after the finished product for beautification, such as should be as far as possible along the front of the hidden flywire; for the back of the flywire is as little as possible, it is best to take shortcuts; and solder joints and longer flywire with the least amount of glass adhesive will be covering it, Fixed, so that it does not affect the external appearance. Because for the first-class PCB processor, both inside and outside are equally important; so also remove excess signs, the colour should also be consistent and to keep the PCB board clean, such as stained with dirt, to use a brush or cotton ball cleaning.
After the completion of each piece of PCB processing, we have to go through the tedious work of finishing before packaging, and each consumer to get the finished product has gone through countless procedures and can not have any errors. Every honest and reliable PCB processing manufacturers are strictly enforced on the above process, and also continue to strive for excellence, only for their own more professional, only to trust its consumers to bring more affordable PCB processing products.
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