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SMT chip processing technology assembly method details
发布时间：2024-05-23 15:11
According to the specific requirements of the assembled product and the conditions of the assembly equipment to choose the appropriate assembly method, is the basis of efficient, low-cost assembly production, but also the main content of the SMT SMD processing process design.
The so-called surface assembly technology, refers to the sheet structure of the components or miniaturised components suitable for surface assembly, in accordance with the requirements of the circuit is placed on the surface of the printed circuit board, assembled with the reflow soldering or wave soldering and other welding processes, constituting a certain function of the electronic components of the assembly technology.
In the traditional THT printed circuit boards, components and solder joints are located on both sides of the board, while in the SMT SMD printed circuit boards, solder joints and components are on the same side of the board. Therefore, in the SMT SMD printed circuit board, through holes are only used to connect the wires on both sides of the board, the number of holes is much smaller, the diameter of the holes is also much smaller, which can make the circuit board assembly density greatly improved. The following is an introduction to the two assembly methods of SMT chip processing technology.
First, SMT single-sided mixed assembly mode
The first category is a single-sided mixed assembly, that is, SMC / SMD and through-hole inserted components (17HC) distributed on a different side of the PCB mixed assembly, but the welding surface is only single-sided. This type of assembly are used in single-sided PCB and wave soldering (now generally used double wave soldering) process, there are two specific assembly methods.
(1) first paste method. The first assembly method is known as the first paste method, that is, in the B side of the PCB (soldering surface) first pasted SMC / SMD, and then in the A side of the insertion of THC.
(2) Post-paste method. The second assembly method is called post-paste method, is first in the PCB on the A side of the insertion of THC, after the B side of the SMD paste.
Second, SMT double-sided mixed assembly method
The second type is double-sided mixed assembly, SMC / SMD and T.HC can be mixed distribution on the same side of the PCB, at the same time, SMC / SMD can also be distributed on both sides of the . PCB. Double-sided hybrid assembly uses double-sided PCB, double wave soldering or reflow soldering. In this category of assembly methods also have the first paste or post SMC / SMD difference, generally according to the type of SMC / SMD and the size of the PCB reasonable choice, usually using the first paste method is more. This type of assembly commonly used two assembly methods.
(1) SMC/SMD and FHC same side way, SMC/SMD and THC with the same side of the .PCB.
(2) SMC/SMD and iFHC different side way, the surface assembly integrated chip (SMIC) and THC on the A side of the PCB, while the SMC and small outline transistor (SOT) on the B side.
This type of assembly method has a fairly high assembly density due to the placement of SMC/SMD on one or both sides of the PCB and the insertion of leaded components that are difficult to assemble on the surface.
SMT SMD assembly and its process mainly depends on the type of surface-mounted assembly (SMA), the type of components used and the conditions of the assembly equipment. Broadly speaking, SMA can be divided into single-sided mixed assembly, double-sided mixed assembly and full-surface assembly of three types of a total of six types of assembly. SMAs of different types are assembled differently, and SMAs of the same type may also be assembled differently.
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2024-05-23
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