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Poke this PCB thermal design nine principles and design tips
发布时间：2024-05-23 15:03
In the design of electronic equipment, the thermal design of PCBs (Printed Circuit Boards) is a key factor in ensuring stable operation and prolonging the service life of the equipment. In this paper, we will explain the PCB thermal design need to follow several principles, and one by one to explain its importance.
1, temperature-sensitive device layout principles
In the layout of components, in addition to temperature detection devices other than temperature-sensitive devices should be placed close to the location of the air inlet, and should be located in the upper reaches of the air duct of the components with high power and heat. This can effectively reduce the operating temperature of the sensitive devices and improve stability. If you can not stay away from the heat source, you should use a heat shielding plate to isolate and reduce the impact of heat radiation on sensitive devices.
2, heat-resistant device layout principles
For its own heat and heat-resistant devices, should be placed near the location of the air outlet or the top, in order to make full use of the convection heat effect. If the device can not withstand higher temperatures, it should be placed near the air inlet, and with other heat devices and heat-sensitive devices in the direction of air rise staggered position to prevent heat accumulation.
3, high-power components layout principles
High-power components should be dispersed layout as far as possible, to avoid the concentration of heat sources, in order to reduce the overall temperature. At the same time, components of different sizes and dimensions should be arranged as evenly as possible, so that the wind resistance is even, the air volume is evenly distributed, and the heat dissipation efficiency is improved.
4, vent design principles
The design of vents should be optimised for devices with high heat dissipation requirements to ensure that the airflow can be accurately aligned with these devices to achieve effective heat dissipation. Reasonable vent design can significantly improve the cooling efficiency and reduce the temperature of the device.
5, device height and arrangement principles
High devices should be placed behind the low device, and the long direction along the wind resistance of the direction of the smallest row, in order to prevent obstruction of the air duct. This layout ensures smooth airflow and improves heat dissipation.
6, radiator configuration principles
The configuration of the radiator should facilitate the circulation of heat exchange air in the cabinet. When relying on natural convection heat transfer, the length of the cooling rib should be perpendicular to the ground; when relying on forced air heat dissipation, it should take the same direction as the direction of the airflow. This can maximise the use of the radiator's cooling capacity and improve the cooling efficiency.
7、Radiator arrangement principle
In the direction of air flow, it is not suitable to arrange multiple radiators in close proximity longitudinally to avoid the upstream radiators will be separated from the airflow, resulting in a lower air velocity on the surface of the downstream radiators. Staggered arrangement or staggered cooling fins should be used to improve the heat dissipation effect.
8, heat sink and component spacing principles
Heat sinks and other components on the same circuit board should be a suitable distance to prevent heat radiation from adversely affecting other components. Through thermal radiation calculations to determine the appropriate spacing to ensure uniform temperature distribution throughout the circuit board.
9, PCB board heat dissipation principles
PCB board itself also has a certain ability to dissipate heat. Through a large area of copper paving or the use of ground connection holes to guide the heat to the plane layer of the PCB board, you can make full use of the entire PCB board to dissipate heat. This way of heat dissipation can effectively reduce the operating temperature of the components, improve the stability and reliability of the equipment.
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2024-05-23
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